Damage Analysis of Semiconductor Chip during Wire Bonding Process.
نویسندگان
چکیده
منابع مشابه
Evaluation of wire bonding performance, process conditions, and metallurgical integrity of chip on board wire bonds
Chip on board wire bonding presents challenges to modern wire bonding technology which include smaller, closely spaced wire bond pads; bonding to soft substrates without special processing and pad construction; and diverse first bond and second bond metallurgies. These challenges are addressed by extensive bonding accuracy tests, a design of experiments approach for optimizing wire bond process...
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Wire bonding using copper wire
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A 60-lm bond-pad-pitch wire-bonding process was developed using test dies with a SiO2 dielectric layer under aluminium pads, and was then fine-tuned for a low-k device using three types of gold wires with different mechanical properties. Bulk material hardness of the wires were characterised using a wire-bonding machine, the force applied and diameters of squashed free-air balls. It was found t...
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The real-time monitoring of an industrial ball bonding process is reported using a new type of test chips with custom-made integrated sensors (microsensors). These sensors were fabricated using a commercial double-metal CMOS process [1]. Two types of integrated monitors are reported, a temperature [2] and an ultrasound shear force sensor [3]. The temperature sensor uses the thermoelectric prope...
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ژورنال
عنوان ژورنال: TRANSACTIONS OF THE JAPAN SOCIETY OF MECHANICAL ENGINEERS Series A
سال: 1996
ISSN: 0387-5008,1884-8338
DOI: 10.1299/kikaia.62.872